|
| PCN Code |
PCN Reference |
Insertion Date |
| |
PCSR2003004 |
31-Oct-03 |
| |
PCSR2003005 |
6-Nov-03 |
| 141 |
DSG-COM/03/141 |
21-Jan-03 |
| |
DSG-COM/03/145 |
24-Jan-03 |
| |
DSG-DIS/03/322 |
28-Aug ,2003 |
| |
DSG/03/288 |
13- Oct-2003 |
| |
DSG/03/346 |
14-Oct-03 |
| |
DSG/03/368 |
27-Nov-03 |
| |
DSG/03/380 |
28-Nov-03 |
| |
DSG-COM/03/391 |
11-Dec-03 |
| |
MPG EEP/04/451 |
12-Feb-04 |
| |
CMG-IMG/04/457 |
26-Feb-04 |
| |
CMG-TVD/04 493 |
16-Apr-2004 |
| |
MPG EEP/04/578 |
28-Jun-04 |
| |
CMG-TVD/04/635 |
20-Jul-,2004 |
| |
CMG-TVD/04/634 |
20-Jul-2004 |
| |
CMG-TVD/04/651 |
23-Jul-2004 |
| |
CMG-TVD/04/677 |
08-Sep-2004 |
| |
CMG-TVD/04/678 |
8-Oct-04 |
| |
CMG-TVD/04/679 |
8-Oct-04 |
| |
CMG-TVD/04/683 |
8-Oct-04 |
| 688 |
MPG-NVR/04/688 |
12-Aug-04 |
| |
CMG-TVD/04/742 |
10-May-04 |
| |
CMG-TVD/04/743 |
10-Jun-04 |
| |
CRP 04/744 |
8-Nov-2004 |
|
PIL 1014 MOLDING MATERIAL IMPROVEMENT FOR
SO NARROW PREPLATED PACKAGES
|
20-May-2005
|
|
PCN 1015 SUBSTRATE METALLISATION AND LEAD
FREE SOLDER BALLS CHANGE FOR BGA PACKAGES WITH SIZE EQUAL OR
BELOW 23X23
|
20-May-2005
|
| PIL Reference |
PIL Title |
| CQA
/01/2003 |
LEADFREE COMPONENTS CONNECTIONS |
| CRP/05/904 |
New Format for Standard Label Inner box (“bulk”) |
|
|
 |
