E3/E4 Initiative

Starting January 2001, top 3 European semiconductor device manufacturers: STMicroelectronics, Philips Semiconductors and Infineon Technologies are working together in the E3 (Environmental 3) Initiative to promote standardization, methodologies and a common roadmap towards Lead-free electronics. Since June 3rd 2004 the Initiative is extended to Freescale Semiconductors; it is now named E4 (Environmental 4).

Aim of E4 is to provide high quality drop-in solutions for Lead-free applications to all Customers of the E4 members. E4 will share databases and methodologies, collaborate on standards and develop a common conversion strategy for the transition to Lead-free.

9 common documents have been published on Lead-free Matte Tin plated components and on whisker risk prevention:

• E3 Tin Whisker Formation - Results, Test Methods and Countermeasures
• E3 Whisker Root Cause and Respective Test Conditions
• E3 Data on solderability of leadfree parts
• E3 Data on whiskers for parts done with Cu
• E3 Lead-free Presentation
• E3 Whiskers data for AL42 frames
• E4 Sn plating in respect to proposed NEMI test conditions
• E4 Whisker Formation on Tin Plated Cu based Leadframes
• E4 Whisker Formation on Tin Plated FeNi42
• E4 Lead-free packaging for Semiconductor Devices